Compact Laser Finishing
XIPHOS Compact Label Finishing Platform
Engineered specifically for short-to-medium digital print jobs, the XIPHOS system combines a compact floor footprint with industrial-grade laser die cutting capabilities. It allows label converters to process complex kiss-cut labels, window cutouts, and slitting inline directly after digital printing presses.
- Spot Size Precision: Focused laser beam spot size down to 0.004 inches (0.1 mm) for crisp geometry.
- Tool-Free Setup: Instant job loading via vector PDF/DXF files—zero physical die inventory needed.
- Inline Finishing: Options for semi-rotary flexo varnishing, lamination, web slitting, and dual rewinding.
- Optimal Footprint: Designed for tight pressroom layouts while maintaining industrial web tension control.